It has always been the lofty goal of my country's manufacturing industry to equip Chinese products with "Chinese chips." All fields of modern technology cannot do without semiconductor chips. The advent of the "smart +" era has higher requirements for the performance of semiconductor chips. The semiconductor industry cannot do without wafers, which are the basis for making chips. The thickness of the wafer has a great influence on the stress and performance of the wafer. Therefore, the rapid and accurate detection of the wafer thickness is a very important link in the production of wafers. The current traditional measurement methods are inefficient and there are Circle poses the risk of pollution. Through unremitting efforts, Xiangping Technology has independently developed a non-contact wafer thickness gauge, which is convenient to use, high in measurement accuracy, and high in measurement efficiency, and will not cause damage to the wafer.